WS.III - IPCEIs Microelectronics

updated on September 5, 2024


WS.III IPCEIs MICROELECTRONICS: DEVICES AND SYSTEMS DRIVING THE DIGITAL AND GREEN TRANSITION September 12
Co-organized with:

WORKSHOP COMMITTEE Andrea PORCARI, AIRI Cosimo MUSCA, STMicroelectronics

Europe is increasingly investing to strengthen our capacity and leadership in the semiconductor value chain, from materials to design, manufacturing and packaging of advanced chips and electronics devices and systems. The 2023 EU Chips Act is leveraging R&I efforts of all EU players in the field, and the two IPCEI (Important Projects of Common Interest) ME and ME/CT (MicroElectronics and Communication Technology) are supporting the transformation. IPCEI ME/CT builds on the first IPCEI ME results and involves 68 projects from 56 companies and an ecosystem of over 600 R&I players. Breakthrough are expected along four lines: sensing, thinking, acting, communicating, toward more efficient, faster, secure and reliable devices . Italy and Austria are key players in all technology fields of IPCEI, such as novel semiconductor materials, sensors, actuators, high performance processors, and artificial intelligence systems. Solutions developed are strategic assets for major industrial value chains, including communications (5G, 6G), autonomous driving, digital technologies, energy generation, distribution and use. The workshop, following the events held in 2020 and 2022, will provide an opportunity for companies, R&I centres, and universities to learn on the achievements and ongoing activities of IPCEI, and network with key players of the field. The first part will include talks from authoritative IPCEI partners. The second part will be a matchmaking session with IPCEI representatives, open to large industries, SMEs, startups, research organizations willing to meet, share and discuss RtoB and BtoB opportunities with IPCEI representatives.
READ HERE the catalogue with the profile of the organizations and speakers participating to the matchmaking.

September 12
14:00 - 15:30 IPCEIs solutions WS.III.1 - TT.VII.B
Co-organized with AIRI, STMicroelectronics, Infineon Chairs: Andrea PORCARI, AIRI & Cosimo MUSCA, STMicroelectronics
WS.III.1.1 TT.VII.B.1	Josef MOSER - CV Infineon Technologies, Austria Trapped ion quantum processor units (ionQPUs) for scalable quantum computers: developments and quality improvements
WS.III.1.2 TT.VII.B.2	André MUGLIETT STMicroelectronics, Malta Assembly, Test and Packaging is a critical step of the Semiconductors supply chain: Malta IPCEI supports re-shoring capacity and grow on innovative technology
WS.III.1.3 TT.VII.B.3	Sandra EGER - CV AT&S, Austria IC substrates & advanced packaging Technologies: key to the Computing systems of the Future
WS.III.1.4 TT.VII.B.4	Emanuele CORSI - CV MEMC-GlobalWafers The TeNeT Project: Leading Edge 300mm and 200mm Silicon Wafers Manufacturing in Italy to Strengthen the Europe’s Microelectronic Ecosystem

16:00 - 17:30 IPCEIs solutions & matchmaking WS.III.2 - TT.VIII.B
Co-organized with AIRI, STMicroelectronics & Infineon Chairs: Andrea PORCARI, AIRI & Cosimo MUSCA, STMicroelectronics
Register to the matchmaking session to meet, share, and discuss research and business opportunities with IPCEI representatives. PRE-REGISTER HERE Info: www.airi.it
WS.III.2.1 TT.VIII.B.1	Lorenza FERRARIO - CV, Micro Nano Facility Vittorio GUARNIERI - CV, FBK MNF the Fondazione Bruno Kessler semiconductor Open Facility
WS.III.2.2 TT.VIII.B.2	Salvatore LOMBARDO - CV CNR-IMM The microtech for green project
WS.III.2.3 TT.VIII.B.3	Alessandro FONTE - CV Siae Microelettronica Enabling Microelectronics Solutions for Next-Generation High-Performance 6G Networks
WS.III.2.4 TT.VIII.B.4	Alfredo MAGLIONE - CV Optoi Photonic sensors and MEMS microsystems: the OPTOI microelectronic packaging facility
WS.III.2.5 TT.VIII.B.5	Marco DELUCA - CV Silicon Austria Labs GmbH (SAL), Austria Leading advanced thin film technologies for electronic-based microsystems
WS.III.2.6 TT.VIII.B.6	Elke KRAKER - CV Material Center Leoben, GmbH (MCL), Austria Materials understanding is the key to new innovations in microelectronics