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    updated on August 9, 2024

Stress in Thin Films

     
   12 Sept. clessidra che gira 09:00 - 10:30
 
Advanced Materials 01
ADVANCED MATERIALS
MICROSCOPY NANOCHARACTERIZATION
MICROSCOPY & NANOCHARACTERIZATION
TT.V Technical Multi-Track with Parallel SYMPOSIA
Stress in Thin Films
Co-organized with Roma Tre University, Sapienza University of Rome
Chair: Marco SEBASTIANI, Roma Tre University
This session is the first part (of two) of the workshop on 'Exploring Stress and Strain in Thin Films and Semiconductor Materials' with the aim to provide a focused platform for researchers and professionals to discuss the latest developments and research results related to stress and strain in thin films and semiconductor materials. Co-organised by Roma Tre University and Sapienza University of Rome, the event is structured into two distinct sessions, each dedicated to a specific aspect of the topic. This first session will focus on stress in thin films, covering topics such as the origin and control of residual stress, advanced measurement techniques and the impact of stress on the reliability of micro-electro-mechanical systems (MEMS). The second session will focus on strain in semiconductor materials, discussing the effects of strain on material properties, recent advances in measurement and control techniques, and the challenges of managing strain for improved material performance. This split will allow for an in-depth exploration of both stress and strain, providing participants with a comprehensive understanding of the interrelationships and differences between these two critical areas of materials science. The workshop brings together leading experts in the field to share their insights and latest research, providing valuable opportunities for learning and collaboration.
The symposium is part of the WS.VIII
TT.V.C.1 WS.VIII.1.1 Rostislav DANIEL
Montanuniversität Leoben, Austria
Origins and control of residual stress in thin films
!DONNA  
TT.V.C.2 WS.VIII.1.2 Edoardo ROSSI
Roma Tre University
High resolution measurement Techniques for Stress in Thin Films
!DONNA  
TT.V.C.3 WS.VIII.1.3 Savvas ORFANIDIS
National Technical University of Athens, Greece
NanoMECommons: Harmonisation of EU-wide nanomechanics protocols and relevant data exchange procedures, across representative cases; standardisation, interoperability, data workflow
!DONNA  
TT.V.C.4 WS.VIII.1.4 Matthieu LE BAILLIF
Thales Researche and Technology, France
Residual Stress and reliability in Micro-Electromechanical Systems (MEMS)
!DONNA  
TT.V.C.5 WS.VIII.1.5 Saqib RASHID
Roma Tre University
In-situ measurement of residual stress in MEMS devices
!DONNA  
 

 

 
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Dr. Federica SCROFANI

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